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Advances in electronic packaging 1993 :

Advances in electronic packaging 1993 : Vol. 1 / ed. by Peter A. Engel and William T. Chen. - The American Society of Mechanical Engineers, 1993. - xi, 550 p. : fig.

Includes bibliogr. references.

Subjects--Index Terms: ელექტროტექნიკა

Universal Decimal Class. No.: 621.3

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Advances in electronic packaging 1993 :