MARC details
| 000 -LEADER |
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| fixed length control field |
05660nam a22003497a 4500 |
| 001 - CONTROL NUMBER |
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| control field |
2186998 |
| 003 - CONTROL NUMBER IDENTIFIER |
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| control field |
Ge_NSL |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
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| control field |
20200814154810.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
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| fixed length control field |
101027t us ||||| |||| 00| 0 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
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| International Standard Book Number |
1558994211 |
| 040 ## - CATALOGING SOURCE |
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| Original cataloging agency |
LHL |
| Transcribing agency |
LHL |
| Modifying agency |
OrLoB-B |
| 041 ## - LANGUAGE CODE |
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| Language code of text/sound track or separate title |
eng |
| 080 ## - UNIVERSAL DECIMAL CLASSIFICATION NUMBER |
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| Universal Decimal Classification number |
620.22(063) |
| 245 00 - TITLE STATEMENT |
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| Title |
Electronic packaging materials science X : |
| Remainder of title |
symposium held April 14-16, 1998, San Francisco, California, U.S.A. / |
| Statement of responsibility, etc |
editors, Daniel J. Belton ... [et al.]. |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) |
|---|
| Place of publication, distribution, etc |
Warrendale, Pennsylvania. : |
| Name of publisher, distributor, etc |
Materials Research Society, |
| Date of publication, distribution, etc |
c1998. |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
ix, 262 p. : |
| Other physical details |
ill. ; |
| Dimensions |
24 cm. |
| 490 1# - SERIES STATEMENT |
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| სერიის ცნობა |
Materials Research Society symposium proceedings ; |
| Volume number/sequential designation |
v. 515 |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE |
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| Bibliography, etc |
Includes bibliographic references and indexes. |
| 505 00 - FORMATTED CONTENTS NOTE |
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| Title |
Efficient Interfacial Design - A Multidisciplinary View / |
| Statement of responsibility |
C. F. Shih, W. T. Chen and B. Cotterell [et al.] -- |
| Title |
Experimental Investigation of Interfacial Adhesion in Microelectronic Assemblies / |
| Statement of responsibility |
Xiang Dal, Mark V. Brillhart and Paul S. Ho -- |
| Title |
Molecular Modelling as a Tool for Adhesive Performance Understanding / |
| Statement of responsibility |
N. Iwamoto, J. Pedigo and A. Grieve [et al.] -- |
| Title |
A Combined Analysis of Moisture Diffusion with Interface Fracture Mechanics on the Interface Delamination in the Plastic IC Packages During Reflow Soldering / |
| Statement of responsibility |
Y. B. Park and Jin Yu -- |
| Title |
Adhesion and Subcritical Debonding of Polymer Interfaces for Microelectronic Packaging / |
| Statement of responsibility |
J. M. Snodgrass, G. Hotchkiss and R. H. Dauskardt -- |
| Title |
Analysis of Catastrophic Field Failures Due to Conductive Anodic Filament (CAF) Formation / |
| Statement of responsibility |
W. J. Ready, B. A. Smith and L. J. Turbini [et al.] -- |
| Title |
The Effects of Interfaces on C-4 Solder Bump Reliability / |
| Statement of responsibility |
Michael J. Sullivan -- |
| 505 80 - FORMATTED CONTENTS NOTE |
|---|
| Title |
The Study on the Under Bump Metallurgy (UBM) and 63SN-37PB Solder Bumps Interface for Flip-Chip Interconnection / |
| Statement of responsibility |
Se-Young Jang and Kyung-Wook Paik -- |
| Title |
Under Bump Metallization Development for Eutectic Pb-Sn Solders / |
| Statement of responsibility |
S. J. Hong, T. M. Korhonen and M. A. Korhonen [et al.] -- |
| Title |
Flip-Chip Metallurgies for Lead-Free Solders / |
| Statement of responsibility |
T. M. Korhonen, S. J. Hong and M. A. Korhonen [et al.] -- |
| Title |
Maskless, Direct Deposition of Copper onto Aluminum Bond Pads for Flip-Chip Applications / |
| Statement of responsibility |
M. Fang, T. O'Keefe and M. Stroder [et al.] -- |
| Title |
Alloy Joints for High-Temperature Electronic Packaging / |
| Statement of responsibility |
William W. So and Chin C. Lee -- |
| Title |
Direct Measurements of Thermal Stress Distributions in Large Die Bonds for Power Electronics / |
| Statement of responsibility |
Jun He, M. C. Shaw and N. Sridhar [et al.] -- |
| Title |
Damage Evolution and Mechanical Failure in Flip-Chip Interconnects / |
| Statement of responsibility |
A. Soper, I. De Wolf and G. Pozza [et al.] -- |
| Title |
On the Shear Strength and Mixed-Mode Fracture Toughness of a Lead-Tin and a Tin-Silver Solder / |
| Statement of responsibility |
M. Manoharan, K. S. Siow and M. W. Weiser -- |
| 505 80 - FORMATTED CONTENTS NOTE |
|---|
| Title |
Underflow Process for Direct-Chip-Attachment Packaging / |
| Statement of responsibility |
P. C. Li, G. L. Lehmann and J. Cascio [et al.] -- |
| Title |
Evaluation of Potential Printed Wiring Board Materials: Thermoplastic Polyimide + Polymer Liquid Crystal Blends / |
| Statement of responsibility |
Witold Brostow, Nandika Anne D'Souza and Bhaskar Gopalanarayanan [et al.] -- |
| Title |
High-Density, High-Thermal Dissipation Substrates Fabricated Using a Conductive Composite Material / |
| Statement of responsibility |
Lutz Brandt, Goran Matijasevic and Pradeep Gandhi [et al.] -- |
| Title |
Novel, Matched CTE Integrated Substrates for Power Electronics / |
| Statement of responsibility |
W. Kowbel, X. Xia and C. Bruce [et al.] -- |
| Title |
Thermomechanical Stresses in Laminated Polymer Films on Silicon Substrates / |
| Statement of responsibility |
Jin S. Kim, Kyung W. Paik and Seung H. Oh [et al.] -- |
| Title |
Electroplating of Gold-Tin Solder for Optoelectronic Applications / |
| Statement of responsibility |
Wenzhen Sun and Douglas G. Ivey -- |
| Title |
A Study of Solder Paste Rheology for the Alternative Assembly and Reflow Technology (AART) Process / |
| Statement of responsibility |
S. T. Murthy, D. Manessis and K. Srihari [et al.] -- |
| 505 80 - FORMATTED CONTENTS NOTE |
|---|
| Title |
Whole-Field Displacement Measurement Techniques for Thermal Deformation Analyses of Electronic Packages / |
| Statement of responsibility |
Bongtae Han -- |
| Title |
Reliability and Lifing Methodologies for Microelectronic Systems / |
| Statement of responsibility |
Ken Reifsnider -- |
| Title |
Stress Evolution During Thermoset Cure / |
| Statement of responsibility |
Yuhai Mei, Albert F. Yee and Alan S. Wineman [et al.] -- |
| Title |
On the Influence of Titanium Alloy Composition and Layer Thickness on the Mechanical Properties of a Polyimide Substrate / |
| Statement of responsibility |
G. Muralidharan, B. Narayanan and C. C. Wong [et al.] -- |
| Title |
On the Mechanical Properties of a Poly(Oxazolidone) Polymer for Encapsulant Applications / |
| Statement of responsibility |
M. Manoharan and K. S. Chian -- |
| Title |
Thermal Control of Interfaces for Microelectronic Packaging / |
| Statement of responsibility |
E. E. Marotta and B. Han -- |
| Title |
Crack Propagation Experiments on Flip-Chip Solder Joints / |
| Statement of responsibility |
S. Wiese, F. Feustel and S. Rzepka [et al.] -- |
| Title |
Experimental Characterization of Material Properties of 63Sn37Pb Flip Chip Solder Joints / |
| Statement of responsibility |
S. Wiese, F. Feustel and S. Rzepka [et al.] -- |
| 505 80 - FORMATTED CONTENTS NOTE |
|---|
| Title |
Fracture Behavior of Epoxy-Based, Hybrid Particulate Composites / |
| Statement of responsibility |
M. F. DiBerardino and R. A. Pearson -- |
| Title |
Optical Probes and Electrical Resistivity Measurements of Conductive Die Attach Adhesives / |
| Statement of responsibility |
Joseph Miragliotta, Richard C. Benson and Terry E. Phillips [et al.] -- |
| Title |
Effect of Humidity on Charge Profiles and Thermal Properties of 1.7 [mu]m Polyimide Films on Silicon Substrates / |
| Statement of responsibility |
P. Bloss, A. S. De Reggi and H. Schafer. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name as entry element |
Electronic packaging |
| Form subdivision |
Congresses. |
| 9 (RLIN) |
8859 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name as entry element |
Electronic packaging |
| General subdivision |
Materials |
| Form subdivision |
Congresses. |
| 9 (RLIN) |
8860 |
| 653 ## - INDEX TERM--UNCONTROLLED |
|---|
| Uncontrolled term |
მასალები - კონფერენციები |
| 653 ## - INDEX TERM--UNCONTROLLED |
|---|
| Uncontrolled term |
მასალების შესწავლა - კონფერენციები |
| 700 1# - ADDED ENTRY--PERSONAL NAME |
|---|
| Personal name |
Belton, Daniel James, |
| Dates associated with a name |
1948- |
| 9 (RLIN) |
8861 |
| Relator term |
რედაქტორი |
| 711 2# - ADDED ENTRY--MEETING NAME |
|---|
| Meeting name or jurisdiction name as entry element |
Symposium on Electronic Packaging Materials Science |
| Number of part/section/meeting |
(10th : |
| Date of meeting |
1998 : |
| Location of meeting |
San Francisco, Calif.) |
| 9 (RLIN) |
8862 |
| 900 ## - EQUIVALENCE OR CROSS-REFERENCE-PERSONAL NAME [LOCAL, CANADA] |
|---|
| Numeration |
TOC |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
|---|
| Source of classification or shelving scheme |
Universal Decimal Classification |
| Item type |
წიგნი |