Advances in electronic packaging 1993 :  Vol. 2 / 
ed. by Peter A. Engel and William T. Chen. 
 -  The American Society of Mechanical Engineers,  1993. 
 - ix, 551-1200 p.  fig. 
<br/><br/>Includes bibliogr. references. 
<br/><br/><label>Subjects--Index Terms: </label>ელექტროტექნიკა 
<br/><br/><label>Universal Decimal Class. No.: </label>621.3