TY  - BOOK
AU  - Pham,Anh-Vu H.
AU  - Chen,Morgan J.
AU  - Aihara,Kunia
TI  - LCP for microwave packages and modules
T2  - The Cambridge RF and microwave engineering series
SN  - 9780511777240 (ebook)
AV  - TK7876 .L387 2012
U1  - 621.381/3 23
PY  - 2012///
CY  - Cambridge
PB  - Cambridge University Press
KW  - Microwave devices
KW  - Materials
KW  - Flexible electronics
KW  - Microelectronic packaging
KW  - Liquid crystal devices
KW  - Polymer liquid crystals
N1  - Title from publisher's bibliographic system (viewed on 05 Oct 2015); Machine generated contents note: 1. Introduction; 2. Characteristics of liquid crystal polymer (LCP) Morgan J. Chen, Kunia Aihara, Cheng Chen and Anh-Vu H. Pham; 3. Fabrication techniques for processing LCP laminates; 4. LCP for wafer level chip scale MEMS; 5. LCP for surface mount interconnects, packages, and modules; 6. LCP for passive components Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 7. LCP for system design Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 8. LCP reliability
N2  - A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering
UR  - https://doi.org/10.1017/CBO9780511777240
ER  -