TY  - BOOK
AU  - Belton,Daniel James
ED  - Symposium on Electronic Packaging Materials Science
TI  - Electronic packaging materials science X: symposium held April 14-16, 1998, San Francisco, California, U.S.A. 
T2  - Materials Research Society symposium proceedings
SN  - 1558994211
PY  - 1998///
CY  - Warrendale, Pennsylvania.
PB  - Materials Research Society
KW  - Electronic packaging
KW  - Congresses
KW  - Materials
KW  - მასალები - კონფერენციები
KW  - მასალების შესწავლა - კონფერენციები
N1  - Includes bibliographic references and indexes; Efficient Interfacial Design - A Multidisciplinary View; C. F. Shih, W. T. Chen and B. Cotterell [et al.] --; Experimental Investigation of Interfacial Adhesion in Microelectronic Assemblies; Xiang Dal, Mark V. Brillhart and Paul S. Ho --; Molecular Modelling as a Tool for Adhesive Performance Understanding; N. Iwamoto, J. Pedigo and A. Grieve [et al.] --; A Combined Analysis of Moisture Diffusion with Interface Fracture Mechanics on the Interface Delamination in the Plastic IC Packages During Reflow Soldering; Y. B. Park and Jin Yu --; Adhesion and Subcritical Debonding of Polymer Interfaces for Microelectronic Packaging; J. M. Snodgrass, G. Hotchkiss and R. H. Dauskardt --; Analysis of Catastrophic Field Failures Due to Conductive Anodic Filament (CAF) Formation; W. J. Ready, B. A. Smith and L. J. Turbini [et al.] --; The Effects of Interfaces on C-4 Solder Bump Reliability; Michael J. Sullivan --; The Study on the Under Bump Metallurgy (UBM) and 63SN-37PB Solder Bumps Interface for Flip-Chip Interconnection; Se-Young Jang and Kyung-Wook Paik --; Under Bump Metallization Development for Eutectic Pb-Sn Solders; S. J. Hong, T. M. Korhonen and M. A. Korhonen [et al.] --; Flip-Chip Metallurgies for Lead-Free Solders; T. M. Korhonen, S. J. Hong and M. A. Korhonen [et al.] --; Maskless, Direct Deposition of Copper onto Aluminum Bond Pads for Flip-Chip Applications; M. Fang, T. O'Keefe and M. Stroder [et al.] --; Alloy Joints for High-Temperature Electronic Packaging; William W. So and Chin C. Lee --; Direct Measurements of Thermal Stress Distributions in Large Die Bonds for Power Electronics; Jun He, M. C. Shaw and N. Sridhar [et al.] --; Damage Evolution and Mechanical Failure in Flip-Chip Interconnects; A. Soper, I. De Wolf and G. Pozza [et al.] --; On the Shear Strength and Mixed-Mode Fracture Toughness of a Lead-Tin and a Tin-Silver Solder; M. Manoharan, K. S. Siow and M. W. Weiser --; Underflow Process for Direct-Chip-Attachment Packaging; P. C. Li, G. L. Lehmann and J. Cascio [et al.] --; Evaluation of Potential Printed Wiring Board Materials: Thermoplastic Polyimide + Polymer Liquid Crystal Blends; Witold Brostow, Nandika Anne D'Souza and Bhaskar Gopalanarayanan [et al.] --; High-Density, High-Thermal Dissipation Substrates Fabricated Using a Conductive Composite Material; Lutz Brandt, Goran Matijasevic and Pradeep Gandhi [et al.] --; Novel, Matched CTE Integrated Substrates for Power Electronics; W. Kowbel, X. Xia and C. Bruce [et al.] --; Thermomechanical Stresses in Laminated Polymer Films on Silicon Substrates; Jin S. Kim, Kyung W. Paik and Seung H. Oh [et al.] --; Electroplating of Gold-Tin Solder for Optoelectronic Applications; Wenzhen Sun and Douglas G. Ivey --; A Study of Solder Paste Rheology for the Alternative Assembly and Reflow Technology (AART) Process; S. T. Murthy, D. Manessis and K. Srihari [et al.] --; Whole-Field Displacement Measurement Techniques for Thermal Deformation Analyses of Electronic Packages; Bongtae Han --; Reliability and Lifing Methodologies for Microelectronic Systems; Ken Reifsnider --; Stress Evolution During Thermoset Cure; Yuhai Mei, Albert F. Yee and Alan S. Wineman [et al.] --; On the Influence of Titanium Alloy Composition and Layer Thickness on the Mechanical Properties of a Polyimide Substrate; G. Muralidharan, B. Narayanan and C. C. Wong [et al.] --; On the Mechanical Properties of a Poly(Oxazolidone) Polymer for Encapsulant Applications; M. Manoharan and K. S. Chian --; Thermal Control of Interfaces for Microelectronic Packaging; E. E. Marotta and B. Han --; Crack Propagation Experiments on Flip-Chip Solder Joints; S. Wiese, F. Feustel and S. Rzepka [et al.] --; Experimental Characterization of Material Properties of 63Sn37Pb Flip Chip Solder Joints; S. Wiese, F. Feustel and S. Rzepka [et al.] --; Fracture Behavior of Epoxy-Based, Hybrid Particulate Composites; M. F. DiBerardino and R. A. Pearson --; Optical Probes and Electrical Resistivity Measurements of Conductive Die Attach Adhesives; Joseph Miragliotta, Richard C. Benson and Terry E. Phillips [et al.] --; Effect of Humidity on Charge Profiles and Thermal Properties of 1.7 [mu]m Polyimide Films on Silicon Substrates; P. Bloss, A. S. De Reggi and H. Schafer
ER  -