National Science Library of Georgia

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Electronic miniaturized packaging and cooling research / R. J. Frindt.

By: Material type: TextTextLanguage: English Fort Belvoir : Defense Technical Information Center, 1961Description: 24 pSubject(s):
Contents:
A report is given of the progress in design of a packaging concept for a ground based computer. This particular type of computer was chosen because of its immediate potential. Cooling of the components is a major consideration in directing the design concept. Manufacturing problems and reliability are also of prime importance. Encapsulation materials and methods, welding of component leads and dip soldering are all investigated from a cost and reliability standpoint. Standard, inexpensive components were used to keep costs competitive and because of their already proven reliability as compared with the newer types now being introduced. (Author).
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Item type Current library Call number Copy number Status Date due Barcode
წიგნი წიგნი ეროვნული სამეცნიერო ბიბლიოთეკა 2 კორპ. 2, საცავი 621.798.:621.3=20 (Browse shelf(Opens below)) И 183 Available 2016-13576

A report is given of the progress in design of a packaging concept for a ground based computer. This particular type of computer was chosen because of its immediate potential. Cooling of the components is a major consideration in directing the design concept. Manufacturing problems and reliability are also of prime importance. Encapsulation materials and methods, welding of component leads and dip soldering are all investigated from a cost and reliability standpoint. Standard, inexpensive components were used to keep costs competitive and because of their already proven reliability as compared with the newer types now being introduced. (Author).

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