Includes bibliographic references and indexes.

Efficient Interfacial Design - A Multidisciplinary View / C. F. Shih, W. T. Chen and B. Cotterell [et al.] -- Experimental Investigation of Interfacial Adhesion in Microelectronic Assemblies / Xiang Dal, Mark V. Brillhart and Paul S. Ho -- Molecular Modelling as a Tool for Adhesive Performance Understanding / N. Iwamoto, J. Pedigo and A. Grieve [et al.] -- A Combined Analysis of Moisture Diffusion with Interface Fracture Mechanics on the Interface Delamination in the Plastic IC Packages During Reflow Soldering / Y. B. Park and Jin Yu -- Adhesion and Subcritical Debonding of Polymer Interfaces for Microelectronic Packaging / J. M. Snodgrass, G. Hotchkiss and R. H. Dauskardt -- Analysis of Catastrophic Field Failures Due to Conductive Anodic Filament (CAF) Formation / W. J. Ready, B. A. Smith and L. J. Turbini [et al.] -- The Effects of Interfaces on C-4 Solder Bump Reliability / Michael J. Sullivan --

The Study on the Under Bump Metallurgy (UBM) and 63SN-37PB Solder Bumps Interface for Flip-Chip Interconnection / Se-Young Jang and Kyung-Wook Paik -- Under Bump Metallization Development for Eutectic Pb-Sn Solders / S. J. Hong, T. M. Korhonen and M. A. Korhonen [et al.] -- Flip-Chip Metallurgies for Lead-Free Solders / T. M. Korhonen, S. J. Hong and M. A. Korhonen [et al.] -- Maskless, Direct Deposition of Copper onto Aluminum Bond Pads for Flip-Chip Applications / M. Fang, T. O'Keefe and M. Stroder [et al.] -- Alloy Joints for High-Temperature Electronic Packaging / William W. So and Chin C. Lee -- Direct Measurements of Thermal Stress Distributions in Large Die Bonds for Power Electronics / Jun He, M. C. Shaw and N. Sridhar [et al.] -- Damage Evolution and Mechanical Failure in Flip-Chip Interconnects / A. Soper, I. De Wolf and G. Pozza [et al.] -- On the Shear Strength and Mixed-Mode Fracture Toughness of a Lead-Tin and a Tin-Silver Solder / M. Manoharan, K. S. Siow and M. W. Weiser --

Underflow Process for Direct-Chip-Attachment Packaging / P. C. Li, G. L. Lehmann and J. Cascio [et al.] -- Evaluation of Potential Printed Wiring Board Materials: Thermoplastic Polyimide + Polymer Liquid Crystal Blends / Witold Brostow, Nandika Anne D'Souza and Bhaskar Gopalanarayanan [et al.] -- High-Density, High-Thermal Dissipation Substrates Fabricated Using a Conductive Composite Material / Lutz Brandt, Goran Matijasevic and Pradeep Gandhi [et al.] -- Novel, Matched CTE Integrated Substrates for Power Electronics / W. Kowbel, X. Xia and C. Bruce [et al.] -- Thermomechanical Stresses in Laminated Polymer Films on Silicon Substrates / Jin S. Kim, Kyung W. Paik and Seung H. Oh [et al.] -- Electroplating of Gold-Tin Solder for Optoelectronic Applications / Wenzhen Sun and Douglas G. Ivey -- A Study of Solder Paste Rheology for the Alternative Assembly and Reflow Technology (AART) Process / S. T. Murthy, D. Manessis and K. Srihari [et al.] --

Whole-Field Displacement Measurement Techniques for Thermal Deformation Analyses of Electronic Packages / Bongtae Han -- Reliability and Lifing Methodologies for Microelectronic Systems / Ken Reifsnider -- Stress Evolution During Thermoset Cure / Yuhai Mei, Albert F. Yee and Alan S. Wineman [et al.] -- On the Influence of Titanium Alloy Composition and Layer Thickness on the Mechanical Properties of a Polyimide Substrate / G. Muralidharan, B. Narayanan and C. C. Wong [et al.] -- On the Mechanical Properties of a Poly(Oxazolidone) Polymer for Encapsulant Applications / M. Manoharan and K. S. Chian -- Thermal Control of Interfaces for Microelectronic Packaging / E. E. Marotta and B. Han -- Crack Propagation Experiments on Flip-Chip Solder Joints / S. Wiese, F. Feustel and S. Rzepka [et al.] -- Experimental Characterization of Material Properties of 63Sn37Pb Flip Chip Solder Joints / S. Wiese, F. Feustel and S. Rzepka [et al.] --

Fracture Behavior of Epoxy-Based, Hybrid Particulate Composites / M. F. DiBerardino and R. A. Pearson -- Optical Probes and Electrical Resistivity Measurements of Conductive Die Attach Adhesives / Joseph Miragliotta, Richard C. Benson and Terry E. Phillips [et al.] -- Effect of Humidity on Charge Profiles and Thermal Properties of 1.7 [mu]m Polyimide Films on Silicon Substrates / P. Bloss, A. S. De Reggi and H. Schafer.