| 000 | 00685nam a22001937a 4500 | ||
|---|---|---|---|
| 003 | Ge_NSL | ||
| 005 | 20170905145841.0 | ||
| 008 | 170905m1993 us ||||| |||| 00| 0 eng d | ||
| 041 | _aeng | ||
| 080 | _a621.3 | ||
| 245 |
_aAdvances in electronic packaging 1993 : _bVol. 2 / _ced. by Peter A. Engel and William T. Chen. |
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| 260 |
_aNew York : _bThe American Society of Mechanical Engineers, _c1993. |
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| 300 |
_aix, 551-1200 p. _bfig. |
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| 504 | _aIncludes bibliogr. references. | ||
| 653 | _aელექტროტექნიკა | ||
| 700 |
_a Engel, Peter A. _eრედაქტორი |
||
| 700 |
_aChen, William T. _eრედაქტორი |
||
| 942 |
_2udc _cBK |
||
| 999 |
_c151187 _d151186 |
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