000 01229cas a22003015a 4500
001 ebs576755
003 EbpS
006 m d ||||||
007 cr anunnnuuuaa
008 920827c19929999ilumn1p 0 a0eng d
022 0 _a1065-0555
_y0747-1599
035 _a(EbpS)ebs576755
050 0 0 _aTK7874
_b.A334
245 0 0 _aAdvanced packaging
_h[electronic resource] :
_ban IHS Group publication.
260 _aLibertyville, Ill., USA :
_bIHS Pub. Group,
_cc1992-
310 _aMonthly (Bimonthly June/July and Nov./Dec.)
362 0 _aVol. 1, no. 1 (summer 1992)-
500 _aTitle from cover.
500 _aPublisher varies.
500 _aTrade Publication
515 _aSome issues lack volume numbering.
530 _aOnline version of print publication.
650 0 _aHybrid integrated circuits
_xDesign and construction
_vPeriodicals.
650 0 _aMicroelectronic packaging
_vPeriodicals.
773 0 _tAcademic Search Premier
_dIpswich, MA : EBSCO Publishing, 1999-
780 0 0 _tHybrid circuit technology
_x0747-1599
_w(DLC) 93640590
_w(OCoLC)10621104
856 4 0 _3Full text available 4/1/2003 - 1/1/2009.
_zAvailable on EBSCOhost.
_uhttp://search.ebscohost.com/direct.asp?db=aph&jid=%229C7%22&scope=site
999 _c38862
_d38862