000			03176nam a22004338i 4500
001			CR9780511777240
003			UkCbUP
005			20200124160218.0
006			m|||||o||d||||||||
007			cr||||||||||||
008			100514s2012||||enk o ||1 0|eng|d
020			_a9780511777240 (ebook)
020			_z9781107003781 (hardback)
040			_aUkCbUP _beng _erda _cUkCbUP
050	0	0	_aTK7876 _b.L387 2012
082	0	0	_a621.381/3 _223
245	0	0	_aLCP for microwave packages and modules / _c[edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara.
246	3		_aLCP for Microwave Packages & Modules
264		1	_aCambridge : _bCambridge University Press, _c2012.
300			_a1 online resource (xiv, 253 pages) : _bdigital, PDF file(s).
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_aonline resource _bcr _2rdacarrier
490	1		_aThe Cambridge RF and microwave engineering series
500			_aTitle from publisher's bibliographic system (viewed on 05 Oct 2015).
505	8		_aMachine generated contents note: 1. Introduction; 2. Characteristics of liquid crystal polymer (LCP) Morgan J. Chen, Kunia Aihara, Cheng Chen and Anh-Vu H. Pham; 3. Fabrication techniques for processing LCP laminates; 4. LCP for wafer level chip scale MEMS; 5. LCP for surface mount interconnects, packages, and modules; 6. LCP for passive components Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 7. LCP for system design Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 8. LCP reliability.
520			_aA comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering.
650		0	_aMicrowave devices _xMaterials.
650		0	_aFlexible electronics.
650		0	_aMicroelectronic packaging _xMaterials.
650		0	_aLiquid crystal devices.
650		0	_aPolymer liquid crystals.
700	1		_aPham, Anh-Vu H., _eeditor.
700	1		_aChen, Morgan J., _eeditor.
700	1		_aAihara, Kunia, _eeditor.
776	0	8	_iPrint version: _z9781107003781
830		0	_aCambridge RF and microwave engineering series.
856	4	0	_uhttps://doi.org/10.1017/CBO9780511777240
999			_c516447 _d516445