000			01280nam a22001937a 4500
003			Ge_NSL
005			20160421160829.0
008			160421s1961 us ||||| |||| 00| 0 eng d
041			_aeng
080			_a621.798.:621.3=20
100			_aFrindt, R. J.
245			_aElectronic miniaturized packaging and cooling research / _cR. J. Frindt.
264			_aFort Belvoir : _bDefense Technical Information Center, _c1961.
300			_a24 p.
505			_aA report is given of the progress in design of a packaging concept for a ground based computer. This particular type of computer was chosen because of its immediate potential. Cooling of the components is a major consideration in directing the design concept. Manufacturing problems and reliability are also of prime importance. Encapsulation materials and methods, welding of component leads and dip soldering are all investigated from a cost and reliability standpoint. Standard, inexpensive components were used to keep costs competitive and because of their already proven reliability as compared with the newer types now being introduced. (Author).
653			_aელექტრონიკა
653			_aმინიატურული ელექტრო მოწყობილობა
942			_2udc _cBK
999			_c54151 _d54151