Electronic packaging materials science X :
Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A. /
editors, Daniel J. Belton ... [et al.].
- Materials Research Society, c1998.
- ix, 262 p. : ill. ; 24 cm.
- Materials Research Society symposium proceedings ; v. 515 .
Includes bibliographic references and indexes.
Efficient Interfacial Design - A Multidisciplinary View / Experimental Investigation of Interfacial Adhesion in Microelectronic Assemblies / Molecular Modelling as a Tool for Adhesive Performance Understanding / A Combined Analysis of Moisture Diffusion with Interface Fracture Mechanics on the Interface Delamination in the Plastic IC Packages During Reflow Soldering / Adhesion and Subcritical Debonding of Polymer Interfaces for Microelectronic Packaging / Analysis of Catastrophic Field Failures Due to Conductive Anodic Filament (CAF) Formation / The Effects of Interfaces on C-4 Solder Bump Reliability / C. F. Shih, W. T. Chen and B. Cotterell [et al.] -- Xiang Dal, Mark V. Brillhart and Paul S. Ho -- N. Iwamoto, J. Pedigo and A. Grieve [et al.] -- Y. B. Park and Jin Yu -- J. M. Snodgrass, G. Hotchkiss and R. H. Dauskardt -- W. J. Ready, B. A. Smith and L. J. Turbini [et al.] -- Michael J. Sullivan -- The Study on the Under Bump Metallurgy (UBM) and 63SN-37PB Solder Bumps Interface for Flip-Chip Interconnection / Under Bump Metallization Development for Eutectic Pb-Sn Solders / Flip-Chip Metallurgies for Lead-Free Solders / Maskless, Direct Deposition of Copper onto Aluminum Bond Pads for Flip-Chip Applications / Alloy Joints for High-Temperature Electronic Packaging / Direct Measurements of Thermal Stress Distributions in Large Die Bonds for Power Electronics / Damage Evolution and Mechanical Failure in Flip-Chip Interconnects / On the Shear Strength and Mixed-Mode Fracture Toughness of a Lead-Tin and a Tin-Silver Solder / Se-Young Jang and Kyung-Wook Paik -- S. J. Hong, T. M. Korhonen and M. A. Korhonen [et al.] -- T. M. Korhonen, S. J. Hong and M. A. Korhonen [et al.] -- M. Fang, T. O'Keefe and M. Stroder [et al.] -- William W. So and Chin C. Lee -- Jun He, M. C. Shaw and N. Sridhar [et al.] -- A. Soper, I. De Wolf and G. Pozza [et al.] -- M. Manoharan, K. S. Siow and M. W. Weiser -- Underflow Process for Direct-Chip-Attachment Packaging / Evaluation of Potential Printed Wiring Board Materials: Thermoplastic Polyimide + Polymer Liquid Crystal Blends / High-Density, High-Thermal Dissipation Substrates Fabricated Using a Conductive Composite Material / Novel, Matched CTE Integrated Substrates for Power Electronics / Thermomechanical Stresses in Laminated Polymer Films on Silicon Substrates / Electroplating of Gold-Tin Solder for Optoelectronic Applications / A Study of Solder Paste Rheology for the Alternative Assembly and Reflow Technology (AART) Process / P. C. Li, G. L. Lehmann and J. Cascio [et al.] -- Witold Brostow, Nandika Anne D'Souza and Bhaskar Gopalanarayanan [et al.] -- Lutz Brandt, Goran Matijasevic and Pradeep Gandhi [et al.] -- W. Kowbel, X. Xia and C. Bruce [et al.] -- Jin S. Kim, Kyung W. Paik and Seung H. Oh [et al.] -- Wenzhen Sun and Douglas G. Ivey -- S. T. Murthy, D. Manessis and K. Srihari [et al.] -- Whole-Field Displacement Measurement Techniques for Thermal Deformation Analyses of Electronic Packages / Reliability and Lifing Methodologies for Microelectronic Systems / Stress Evolution During Thermoset Cure / On the Influence of Titanium Alloy Composition and Layer Thickness on the Mechanical Properties of a Polyimide Substrate / On the Mechanical Properties of a Poly(Oxazolidone) Polymer for Encapsulant Applications / Thermal Control of Interfaces for Microelectronic Packaging / Crack Propagation Experiments on Flip-Chip Solder Joints / Experimental Characterization of Material Properties of 63Sn37Pb Flip Chip Solder Joints / Bongtae Han -- Ken Reifsnider -- Yuhai Mei, Albert F. Yee and Alan S. Wineman [et al.] -- G. Muralidharan, B. Narayanan and C. C. Wong [et al.] -- M. Manoharan and K. S. Chian -- E. E. Marotta and B. Han -- S. Wiese, F. Feustel and S. Rzepka [et al.] -- S. Wiese, F. Feustel and S. Rzepka [et al.] -- Fracture Behavior of Epoxy-Based, Hybrid Particulate Composites / Optical Probes and Electrical Resistivity Measurements of Conductive Die Attach Adhesives / Effect of Humidity on Charge Profiles and Thermal Properties of 1.7 [mu]m Polyimide Films on Silicon Substrates / M. F. DiBerardino and R. A. Pearson -- Joseph Miragliotta, Richard C. Benson and Terry E. Phillips [et al.] -- P. Bloss, A. S. De Reggi and H. Schafer.
1558994211
Electronic packaging--Congresses.
Electronic packaging--Materials--Congresses.
მასალები - კონფერენციები მასალების შესწავლა - კონფერენციები
620.22(063)
Includes bibliographic references and indexes.
Efficient Interfacial Design - A Multidisciplinary View / Experimental Investigation of Interfacial Adhesion in Microelectronic Assemblies / Molecular Modelling as a Tool for Adhesive Performance Understanding / A Combined Analysis of Moisture Diffusion with Interface Fracture Mechanics on the Interface Delamination in the Plastic IC Packages During Reflow Soldering / Adhesion and Subcritical Debonding of Polymer Interfaces for Microelectronic Packaging / Analysis of Catastrophic Field Failures Due to Conductive Anodic Filament (CAF) Formation / The Effects of Interfaces on C-4 Solder Bump Reliability / C. F. Shih, W. T. Chen and B. Cotterell [et al.] -- Xiang Dal, Mark V. Brillhart and Paul S. Ho -- N. Iwamoto, J. Pedigo and A. Grieve [et al.] -- Y. B. Park and Jin Yu -- J. M. Snodgrass, G. Hotchkiss and R. H. Dauskardt -- W. J. Ready, B. A. Smith and L. J. Turbini [et al.] -- Michael J. Sullivan -- The Study on the Under Bump Metallurgy (UBM) and 63SN-37PB Solder Bumps Interface for Flip-Chip Interconnection / Under Bump Metallization Development for Eutectic Pb-Sn Solders / Flip-Chip Metallurgies for Lead-Free Solders / Maskless, Direct Deposition of Copper onto Aluminum Bond Pads for Flip-Chip Applications / Alloy Joints for High-Temperature Electronic Packaging / Direct Measurements of Thermal Stress Distributions in Large Die Bonds for Power Electronics / Damage Evolution and Mechanical Failure in Flip-Chip Interconnects / On the Shear Strength and Mixed-Mode Fracture Toughness of a Lead-Tin and a Tin-Silver Solder / Se-Young Jang and Kyung-Wook Paik -- S. J. Hong, T. M. Korhonen and M. A. Korhonen [et al.] -- T. M. Korhonen, S. J. Hong and M. A. Korhonen [et al.] -- M. Fang, T. O'Keefe and M. Stroder [et al.] -- William W. So and Chin C. Lee -- Jun He, M. C. Shaw and N. Sridhar [et al.] -- A. Soper, I. De Wolf and G. Pozza [et al.] -- M. Manoharan, K. S. Siow and M. W. Weiser -- Underflow Process for Direct-Chip-Attachment Packaging / Evaluation of Potential Printed Wiring Board Materials: Thermoplastic Polyimide + Polymer Liquid Crystal Blends / High-Density, High-Thermal Dissipation Substrates Fabricated Using a Conductive Composite Material / Novel, Matched CTE Integrated Substrates for Power Electronics / Thermomechanical Stresses in Laminated Polymer Films on Silicon Substrates / Electroplating of Gold-Tin Solder for Optoelectronic Applications / A Study of Solder Paste Rheology for the Alternative Assembly and Reflow Technology (AART) Process / P. C. Li, G. L. Lehmann and J. Cascio [et al.] -- Witold Brostow, Nandika Anne D'Souza and Bhaskar Gopalanarayanan [et al.] -- Lutz Brandt, Goran Matijasevic and Pradeep Gandhi [et al.] -- W. Kowbel, X. Xia and C. Bruce [et al.] -- Jin S. Kim, Kyung W. Paik and Seung H. Oh [et al.] -- Wenzhen Sun and Douglas G. Ivey -- S. T. Murthy, D. Manessis and K. Srihari [et al.] -- Whole-Field Displacement Measurement Techniques for Thermal Deformation Analyses of Electronic Packages / Reliability and Lifing Methodologies for Microelectronic Systems / Stress Evolution During Thermoset Cure / On the Influence of Titanium Alloy Composition and Layer Thickness on the Mechanical Properties of a Polyimide Substrate / On the Mechanical Properties of a Poly(Oxazolidone) Polymer for Encapsulant Applications / Thermal Control of Interfaces for Microelectronic Packaging / Crack Propagation Experiments on Flip-Chip Solder Joints / Experimental Characterization of Material Properties of 63Sn37Pb Flip Chip Solder Joints / Bongtae Han -- Ken Reifsnider -- Yuhai Mei, Albert F. Yee and Alan S. Wineman [et al.] -- G. Muralidharan, B. Narayanan and C. C. Wong [et al.] -- M. Manoharan and K. S. Chian -- E. E. Marotta and B. Han -- S. Wiese, F. Feustel and S. Rzepka [et al.] -- S. Wiese, F. Feustel and S. Rzepka [et al.] -- Fracture Behavior of Epoxy-Based, Hybrid Particulate Composites / Optical Probes and Electrical Resistivity Measurements of Conductive Die Attach Adhesives / Effect of Humidity on Charge Profiles and Thermal Properties of 1.7 [mu]m Polyimide Films on Silicon Substrates / M. F. DiBerardino and R. A. Pearson -- Joseph Miragliotta, Richard C. Benson and Terry E. Phillips [et al.] -- P. Bloss, A. S. De Reggi and H. Schafer.
1558994211
Electronic packaging--Congresses.
Electronic packaging--Materials--Congresses.
მასალები - კონფერენციები მასალების შესწავლა - კონფერენციები
620.22(063)